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8766a?seepr?6/12 standard features ? low-voltage operation ? v cc = 1.7v to 5.5v ? internally organized as 512 x 8 (4-kbit) or 1024 x 8 (8-kbit) ? i 2 c-compatible (2-wire) serial interface ? schmitt trigger, filtered inputs for noise suppression ? bidirectional data transfer protocol ? 400khz (1.7v) and 1mhz (2.5v, 2.7, 5.0v) compatibility ? write protect pin for hardware data protection ? 16-byte page write mode ? partial page writes allowed ? self-timed write cycle (5ms max) ? high-reliability ? endurance: 1,000,000 write cycles ? data retention: 100 years ? green package options (pb/halide-free/rohs-compliant) ? 8-lead jedec soic, 8-lead tssop, 8-pad udfn, and 5-lead sot23 ? die sale options: wafer form and tape and reel available enhanced features in the cs serial eeprom series ? all standard features supported ? 128-bit unique factory-programmed serial number ? permanently locked, read-only value ? stored in a separate memory area ? guaranteed unique across entire cs series of serial eeproms atmel AT24CS04 and at24cs08 i 2 c-compatible (2-wire) serial eeprom with a unique, factory programmed 128-bit serial number 4-kbit (512 x 8), 8-kbit (1024 x 8) preliminary datasheet www.datasheet.net/ datasheet pdf - http://www..co.kr/
2 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 1. description the atmel ? AT24CS04 and at24cs08 provides 4096/8192 bits of serial electrically erasable and programmable read-only memory (eeprom) organized as 512/1024 words of eight bits each. the device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. the AT24CS04/08 is available in space-saving, 8-lead jedec soic, 8-lead tssop, 8-pad udfn and 5-lead sot23 packages and is accessed via a 2-wire serial interface. in addition, both devices fully operate from 1.7v to 5.5v v cc . the AT24CS04/08 provides the additional feature of a factory programmed, guaranteed unique 128-bit serial number, while maintaining all of the traditional features available in the 4-kbit or 8-kbit serial eeprom. the time consuming step of performing and ensuring true serialization of product on a manufacturing line can be removed from the production flow by employing the cs series serial eeprom. the 128-bit serial number is programmed and permanently locked from future writing during the atmel production process. further, this 128-bit location does not consume any of the user read/write area of the 4-kbit or 8-kbit serial eeprom. the uniqueness of the serial number is guaranteed across the entire cs series of serial eeproms, regardless of the size of the memory array or the type of interface protocol. this means that as an application's needs for memory size or interface protocol evolve in future generations, any previously deployed serial number from any atmel cs series serial eeprom part will remain valid. 2. pin descriptions and pinout figure 2-1. pin configuration note: for use of 5-lead sot23, the software a2, a1, and a0 bits in the device address word must be set to zero to properly communicate with the device. pin name function nc no connect a 1 address input (4k only) a 2 address input sda serial data scl serial clock input wp write protect gnd ground v cc power supply 1 2 3 4 8 7 6 5 nc a 1 /nc a 2 gnd v cc wp scl sda 8-lead soic 1 2 3 5 4 scl gnd sda wp v cc 5-lead sot23 1 2 3 4 8 7 6 5 v cc wp scl sda nc a 1 /nc a 2 gnd 8-pad udfn bottom view 1 2 3 4 8 7 6 5 nc a 1 /nc a 2 gnd v cc wp scl sda 8-lead tssop www.datasheet.net/ datasheet pdf - http://www..co.kr/
3 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 3. absolute maximum ratings 4. block diagram figure 4-1. block diagram operating temperature ........................?55 ? c to +125 ? c storage temperature ...........................?65 ? c to +150 ? c voltage on any pin with respect to ground .............................?1.0v to +7.0v maximum operating voltage ................................. 6.25v dc output current................................................ 5.0ma *notice: stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. start stop logic data word addr/counter row decoder device address comparator data latches d out / ack logic column decoder eeprom array serial control logic high voltage pump & timing 128-bit serial number serial mux read read/write enable comp load inc v cc gnd wp scl sda d out d in a 2 a 1 www.datasheet.net/ datasheet pdf - http://www..co.kr/
4 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 5. pin description serial clock (scl): the scl input is used to positive edge clock data into each eeprom device and negative edge clock data out of each device. serial data (sda): the sda pin is bidirectional for serial data transfer. this pin is open-drain driven and may be wire-ored with any number of other open-drain or open-collector devices. device addresses (a 2 , a 1 ): the AT24CS04 uses the a 2 and a 1 inputs for hard wire addressing allowing a total of four 4-kbit devices to be addressed on a single bus system. pin 1 is a no connect and can be connected to ground. the at24cs08 only uses the a 2 input for hardware addressing and a total of two 8k devices may be addressed on a single bus system. pins 1 and 2 are no connects and can be connected to ground. refer to section 8. ?device addressing? on page 10 for details about the pin state and the required protocol for communication . the device address pins are not available on the sot23 package offering. refer to section 8. ?device addressing? on page 10 for details on the protocol requirements with this package. write protect (wp): AT24CS04/08 has a write protect (wp) pin that provides hardware data protection. when the write protect pin is connected to ground (gnd), normal read/write operations to the full array are possible. when the write protect pin is connected to v cc , all write operations to the memory are inhibited but read operations are still possible. this operation is summarized in table 5-1 below. table 5-1. write protect wp pin status part of the array protected atmel AT24CS04/08 at v cc full array at gnd normal read/write operations www.datasheet.net/ datasheet pdf - http://www..co.kr/
5 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 6. memory organization atmel AT24CS04, 4k serial eeprom: internally organized with 32 pages of 16 bytes each, the 4-kbit device requires a 9-bit data word address for random word addressing. atmel at24cs08, 8k serial eeprom: internally organized with 64 pages of 16 bytes each, the 8-kbit device requires a 10-bit data word address for random word addressing. table 6-1. pin capacitance (1) note: 1. this parameter is characterized and is not 100% tested. table 6-2. dc characteristics note: 1. v il min and v ih max are reference only and are not tested. applicable over recommended operating range from t a = 25c, f = 1.0mhz, v cc = 1.7v to 5.5v symbol test condition max units conditions c i/o input/output capacitance (sda) 8 pf v i/o = 0v c in input capacitance (a 1 , a 2 , scl) 6 pf v in = 0v applicable over recommended operating range from: t ai = -40 ? c to +85 ? c, v cc = 1.7v to 5.5v (unless otherwise noted) symbol parameter test condition min typ max units v cc supply voltage 1.7 5.5 v i cc1 supply current v cc = 5.0v read at 400khz 0.4 1.0 ma i cc2 supply current v cc = 5.0v write at 400khz 2.0 3.0 ma i sb1 standby current v cc = 1.7v v in = v cc or v ss 1.0 a i sb2 standby current v cc = 5.5v v in = v cc or v ss 6.0 a i li input leakage current v in = v cc or v ss 0.10 3.0 a i lo output leakage current v out = v cc or v ss 0.05 3.0 a v il input low level (1) ?0.6 v cc x 0.3 v v ih input high level (1) v cc x 0.7 v cc + 0.5 v v ol1 output low level v cc = 1.7v i ol = 0.15ma 0.2 v v ol2 output low level v cc = 3.0v i ol = 2.1ma 0.4 v www.datasheet.net/ datasheet pdf - http://www..co.kr/
6 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 table 6-3. ac characteristics note: 1. this parameter is ensured by characterization only. applicable over recommended operating range from t ai = ? 40 ? c to +85 ? c, v cc = 1.7v to 5.5v, cl = 1ttl gate and 100pf (unless otherwise noted) symbol parameter 1.7v 2.5v, 5.0v units min max min max f scl clock frequency, scl 400 1000 khz t low clock pulse width low 1.2 0.4 s t high clock pulse width high 0.6 0.4 s t i noise suppression time 100 50 ns t aa clock low to data out valid 0.1 0.9 0.05 0.55 s t buf time the bus must be free before a new transmission can start 1.3 0.5 s t hd.sta start hold time 0.6 0.25 s t su.sta start setup time 0.6 0.25 s t hd.dat data in hold time 0 0 s t su.dat data in setup time 100 100 ns t r inputs rise time (1) 0.3 0.3 s t f inputs fall time (1) 300 100 ns t su.sto stop setup time 0.6 0.25 s t dh data out hold time 50 50 ns t wr write cycle time 5 5 ms endurance (1) 25 ? c, page mode, 3.3v 1,000,000 write cycles www.datasheet.net/ datasheet pdf - http://www..co.kr/
7 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 7. device operation clock and data transitions: the sda pin is normally pulled high with an external device. data on the sda pin may change only during scl low time periods (see figure 7-4 on page 9 ). data changes during scl high periods will indicate a start or stop condition as defined below. start condition: a high-to-low transition of sda with scl high is a start condition which must precede any other command (see figure 7-5 on page 9 ). stop condition: a low-to-high transition of sda with scl high is a stop condition. after a read sequence, the stop command will place the eeprom in a standby power mode (see figure 7-5 on page 9 ). acknowledge: all addresses and data words are serially transmitted to and from the eeprom in 8-bit words. the eeprom sends a zero to acknowledge that it has received each word. this happens during the ninth clock cycle. standby mode: the AT24CS04/08 features a low-power standby mode which is enabled upon power-up as well as after the receipt of the stop bit and the completion of any internal operations. 2-wire software reset: after an interruption in protocol, power loss, or system reset, any 2-wire part can be reset by following these steps: 1. create a start bit condition. 2. clock nine cycles. 3. create another start bit followed by stop bit condition as shown in figure 7-1 . the device is ready for next communication after above steps have been completed. figure 7-1. software reset scl 9 start bit start bit stop bit 8 3 2 1 sda dummy clock cycles www.datasheet.net/ datasheet pdf - http://www..co.kr/
8 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 figure 7-2. bus timing scl: serial clock, sda: serial data i/o figure 7-3. write cycle timing scl: serial clock, sda: serial data i/o note: 1. the write cycle time t wr is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. scl sda in sda out t f t high t low t low t r t aa t dh t buf t su.sto t su.dat t hd.dat t hd.sta t su.sta t wr (1) stop condition start condition word n scl sda 8 th bit ack www.datasheet.net/ datasheet pdf - http://www..co.kr/
9 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 figure 7-4. data validity figure 7-5. start and stop definition figure 7-6. output acknowledge sda scl data stable data stable data change sda scl start stop scl data in data out start acknowledge 9 8 1 www.datasheet.net/ datasheet pdf - http://www..co.kr/
10 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 8. device addressing standard eeprom access: the 4-kbit and 8-kbit eeprom device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation. the device address word consists of a mandatory ?1010? (ah) sequence for the first four most significant bits as shown in figure 8-1 below. this is common to all serial eeprom devices. the 4k eeprom only uses the a2 and a1 device address bits with the third bit being a memory page address bit (p0). the two device address bits must compare to their corresponding hard-wired input pins. pin 1 is a no connect. the 8k eeprom only uses the a2 device address bit with the next two bits being for memory page addressing (p1, p0). the a2 must compare to its corresponding hard-wired a 2 input pin. pins 1 and 2 are not connected. the eighth bit of the device address is the read/write operation select bit. a read operation is initiated if this bit is high and a write operation is initiated if this bit is low. upon a compare of the device address, the eeprom will output a zero. if a compare is not made, the chip will return to a standby state. note: for the sot23 package offering, the 4-kbit eeprom software a2 and a1 bits in the device address word must be set to zero to properly communicate. the 8-kbit eeprom software a2 bit in the device address word must be set to zero to properly communicate in the sot23 paclkage. serial number access: the AT24CS04 and at24cs08 utilizes a separate memory block containing a factory programmed 128-bit serial number. access to this memory location is obtained by beginning the device address word with a ?1011? (bh) sequence. the behavior of the next three bits remain the same as during a standard eeprom addressing sequence. these three bits must compare to their corresponding hard-wired input pins a 2 and a 1 (4-kbit only) in order for the part to acknowledge. the restrictions for these bits with a sot23 package are the same when accessing the serial number feature. the eighth bit of the device address needs be set to a one to read the serial number. a zero in this bit position, other than during a dummy write sequence to set the address pointer, will result in a unknown data read from the part. writing or altering the 128-bit serial number is not possible. further specific protocol is needed to read the serial number from of the device. see read operations on page 11 for more details on accessing the special feature. table 8-1. device address density access area bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 4-kbit eeprom 1 0 1 0 a 2 a 1 p0 r/ w serial number 1 0 1 1 a 2 a 1 p0 1 8-kbit eeprom 1 0 1 0 a 2 p1 p0 r/ w serial number 1 0 1 1 a 2 p1 p0 1 msb lsb www.datasheet.net/ datasheet pdf - http://www..co.kr/
11 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 9. write operations byte write: a byte write operation requires an 8-bit word address following the device address word and acknowledgment. upon receipt of this address, the eeprom will again respond with a zero and then clock in the first 8-bit data word. following receipt of the 8-bit data word, the eeprom will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. at this time the eeprom enters an internally timed write cycle, t wr , to the nonvolatile memory. all inputs are disabled during this write cycle and the eeprom will not respond until the write is complete (see figure 10-1 on page 12 ). page write: the 4-kbit and 8-kbit devices are capable of 16-byte page writes. a page write is initiated in the same way as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. instead, after the eeprom acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen additional data words. the eeprom will respond with a zero after each data word received. the microcontroller must terminate the page write sequence with a stop condition (see figure 10-2 on page 12 ). the data word address lower four bits are internally incremented following the receipt of each data word. the higher data word address bits are not incremented, retaining the memory page row location. when the internally generated word address reaches the page boundary, the subsequent byte loaded will be placed at the beginning of the same page. if more than sixteen data words are transmitted to the eeprom, the data word address will roll-over and previously loaded data will be overwritten. acknowledge polling: once the internally timed write cycle has started and the eeprom inputs are disabled, acknowledge polling can be initiated. this involves sending a start condition followed by the device address word. the read/write bit is representative of the operation desired. only if the internal write cycle has completed will the eeprom respond with a zero allowing the next read or write sequence to begin. 10. read operations read operations are initiated in the same way as write operations with the exception that the read/write select bit in the device address word is set to one. there are four types of read operations: ? current address read ? random address read ? sequential read ? serial number read current address read: the internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. this address stays valid between operations as long as the chip power is maintained. the address roll-over during read is from the last byte of the last memory page to the first byte of the first page. the address roll-over during write is from the last byte of the current page to the first byte of the same page. once the device address with the read/write select bit set to one is clocked in and acknowledged by the eeprom, the current address data word is serially clocked out. the microcontroller does not respond with an zero but does generate a following stop condition (see figure 10-3 on page 13 ). random read: a random read requires a dummy byte write sequence to load in the data word address. once the device address word and data word address are clocked in and acknowledged by the eeprom, the microcontroller must generate another start condition. the microcontroller now initiates a current address read by sending a device address with the read/write select bit high. the eeprom acknowledges the device address and serially clocks out the data word. the microcontroller does not respond with a zero but does generate a following stop condition (see figure 10-4 on page 13 ). sequential read: sequential reads are initiated by either a current address read or a random address read. after the microcontroller receives a data word, it responds with an acknowledge. as long as the eeprom receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. when the memory address limit is reached, the data word address will roll-over and the sequential read will continue. the sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see figure 10-5 on page 13 ). www.datasheet.net/ datasheet pdf - http://www..co.kr/
12 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 serial number read: reading the serial number is similar to the sequential read sequence but requires use of the device address seen in figure 10-1 on page 12 , a dummy write, and the use of specific word address. note: the entire 128-bit value must be read from the starting address of the serial number block to guarantee a unique number. since the address pointer of the device is shared between the eeprom array and the serial number block, a dummy write sequence should be performed to ensure the address pointer is set to zero. random reads of the serial number block are supported but if the previous operation was to the eeprom array, the address pointer will retain the last access location, incremented by one. reading the serial number from a location other than the initial address of the block will not result in a unique serial number. additionally, the word address must begin with a ?10? sequence regardless of the intended address. if a word address other than ?10? is used, then the device will output undefined data. therefore, if the application desires to read the first byte of the serial number, the word address input would need to be 80h. when the end of the 128-bit serial number is reached (16 bytes of data), the data word address will roll-over back to the beginning of the 128-bit serial number. the serial number read operation is terminated when the microcontroller does not respond with an zero (ack) and instead issues a stop condition (see figure 10-6 on page 14 ). figure 10-1. byte write figure 10-2. page write s t a r t s t o p w r i t e device address word address data sda line m s b r / w a c k a c k a c k s t a r t s t o p w r i t e device address sda line word address (n) data (n) data (n + 1) data (n + x) m s b r / w a c k a c k a c k a c k a c k www.datasheet.net/ datasheet pdf - http://www..co.kr/
13 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 figure 10-3. current address read figure 10-4. random read figure 10-5. sequential read device address data s t a r t r e a d s t o p sda line m s b r / w a c k n o a c k sda line s t a r t w r i t e s t a r t r e a d s t o p device address word address (n) device address data (n) dummy write m s b r / w a c k n o a c k a c k a c k r / w a c k a c k a c k a c k n o a c k sda line r e a d s t o p device address data (n + x) data (n + 2) data (n + 1) data (n) www.datasheet.net/ datasheet pdf - http://www..co.kr/
14 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 figure 10-6. serial number read sda line device address word address n device address s t a r t w r i t e s t a r t r e a d a c k a c k a c k a c k r / w 1 0 1 1 1 0 0 0 0 0 0 0 1 0 1 1 m s b dummy write serial number data byte 0x0 serial number data byte 0x1 serial number data byte 0x2 serial number data byte 0x3 serial number data byte 0xf n o a c k s t o p www.datasheet.net/ datasheet pdf - http://www..co.kr/
15 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 11. part markings drawing no. rev. title catalog number truncation AT24CS04 truncation code ##: n4 at24cs08 truncation code ##: n8 aaaaaaaa ## m @ atmlhyww 8-lead soic 8-lead tssop aaaaaaa ## m @ athyww 8-lead udfn ## hm@ yxx 2.0 x 3.0 mm body 5-lead sot-23 ## mu ymxx bottom mark top mark note 2: package drawings are not to scale note 1: designates pin 1 package mark contact: dl-cso-assy_eng@atmel.com 24cs04-08sm a 5/7/12 24cs04-08sm, AT24CS04 and at24cs08 package marking information date codes voltages y = year m = month ww = work week of assembly m: 1.7v min 2: 2012 6: 2016 a: january 02: week 2 3: 2013 7: 2017 b: february 04: week 4 4: 2014 8: 2018 ... ... 5: 2015 9: 2019 l: december 52: week 52 country of assembly lot number grade/lead finish material @ = country of assembly aaa...a = atmel wafer lot number h: industrial/nipdau u: industrial/matte tin trace code atmel truncation xx = trace code (atmel lot numbers correspond to code) at: atmel example: aa, ab.... yz, zz atm: atmel atml: atmel AT24CS04 and at24cs08: package marking information www.datasheet.net/ datasheet pdf - http://www..co.kr/
16 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 12. ordering code detail atmel designator product family device density shipping carrier option operating voltage 04 = 4k 08 = 8k 24cs = serial eeprom, plus 128-bit serial number feature t = tape and reel m = 1.7v to 5.5v package device grade or wafer/die thickness h = green, nipdau lead finish, industrial temperature range (-40?c to +85?c) u = green, matte sn lead finish, industrial temperature range (-40?c to +85?c) 11 = 11mil wafer thickness package option ss = jedec soic x = tssop ma = udfn st = sot23 wwu = wafer unsawn AT24CS04-sshm-t www.datasheet.net/ datasheet pdf - http://www..co.kr/
17 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 13. ordering information 13.1 atmel AT24CS04 ordering information additional package types that are not listed may be available. please contact atmel for more details. notes: 1. t = tape and reel ? soic = 4k units per reel ? tssop, udfn, and sot23 = 5k units per reel 2. for wafer sales, please contact atmel sales. atmel ordering code package voltage operation range AT24CS04-sshm-t (1) (nipdau lead finish) 8s1 1.7v to 5.5v lead-free/halogen-free/ industrial temperature (?40 ? c to 85 ? c) AT24CS04-xhm-t (1) (nipdau lead finish) 8x AT24CS04-mahm-t (1) (nipdau lead finish) 8ma2 AT24CS04-stum-t (1) 5ts1 AT24CS04-wwu11m (2) wafer sale 1.7v to 5.5v industrial temperature (?40 ? c to 85 ? c) package type 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8x 8-lead, 4.4mm body, plastic thin shrink small outline (tssop) 8ma2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, dual no lead (udfn) 5ts1 5-lead, 2.90mm x 1.60mm body, plastic thin shrink small outline (sot23) www.datasheet.net/ datasheet pdf - http://www..co.kr/
18 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 13.2 atmel at24cs08 ordering information additional package types that are not listed may be available. please contact atmel for more details. notes: 1. t = tape and reel ? soic = 4k units per reel ? tssop, udfn, and sot23 = 5k units per reel 2. for wafer sales, please contact atmel sales. atmel ordering code package voltage operation range at24cs08-sshm-t (1) (nipdau lead finish) 8s1 1.7v to 5.5v lead-free/halogen-free/ industrial temperature (?40 ? c to 85 ? c) at24cs08-xhm-t (1) (nipdau lead finish) 8x at24cs08-mahm-t (1) (nipdau lead finish) 8ma2 at24cs08-stum-t (1) 5ts1 at24cs08-wwu11m (2) wafer sale 1.7v to 5.5v industrial temperature (?40 ? c to 85 ? c) package type 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8x 8-lead, 4.4mm body, plastic thin shrink small outline (tssop) 8ma2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, dual no lead (udfn) 5ts1 5-lead, 2.90mm x 1.60mm body, plastic thin shrink small outline (sot23) www.datasheet.net/ datasheet pdf - http://www..co.kr/
19 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 14. packaging information 14.1 8s1 ? 8-lead jedec soic drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note a1 0.10 ? 0.25 a 1.35 ?1.75 b 0.31 ?0.51 c 0.17 ? 0.25 d 4.80 ? 5.05 e1 3.81 ? 3.99 e 5.79 ?6.20 e 1.27 bsc l 0.40 ?1.27 0? ? 8 e 1 n top view c e1 end view a b l a1 e d side view package drawing contact: packagedrawings@atmel.com 8s1 g 6/22/11 notes: this drawing is for general information only. refer to jedec drawing ms-012, variation aa for proper dimensions, tolerances, datums, etc. 8s1, 8-lead (0.150?wide body), plastic gull wing small outline (jedec soic) swb www.datasheet.net/ datasheet pdf - http://www..co.kr/
20 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 14.2 8x ? 8-lead tssop drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note a - - 1.20 a1 0.05 - 0.15 a2 0.80 1.00 1.05 d 2.90 3.00 3.10 2, 5 e 6.40 bsc e1 4.30 4.40 4.50 3, 5 b 0.19 ? 0.30 4 e 0.65 bsc l 0.45 0.60 0.75 l1 1.00 ref c 0.09 - 0.20 side view end view top view a2 a l l1 d 1 e1 n b pin 1 indicator this corner e e notes: 1. this drawing is for general information only. refer to jedec drawing mo-153, variation aa, for proper dimensions, tolerances, datums, etc. 2. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. dimension e1 does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. dambar cannot be located on the lower radius of the foot. minimum space between protrusion and adjacent lead is 0.07 mm. 5. dimension d and e1 to be determined at datum plane h. h package drawing contact: packagedrawings@atmel.com 8x e 12/8/11 8x, 8-lead 4.4mm body, plastic thin shrink small outline package (tssop) tnr c a1 www.datasheet.net/ datasheet pdf - http://www..co.kr/
21 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 14.3 8ma2 ? 8-pad udfn title gpc ynz drawing no. 8ma2 rev. b common dimensions (unit of measure = mm) symbol min nom max note d 2.00 bsc e 3.00 bsc d2 1.40 1.50 1.60 e2 1.20 1.30 1.40 a 0.50 0.55 0.60 a1 0.0 0.02 0.05 a2 0.55 c 0.152 ref l 0.30 0.35 0.40 e 0.50 bsc b 0.18 0.25 0.30 3 k 0.20 ? 7/15/11 d2 e2 e e (6x) l (8x) b (8x) pin#1 id a a1 a2 pin 1 id d c k 8 7 6 5 1 2 3 4 1 2 3 4 8 7 6 5 notes: 1. this drawing is for general information only. refer to jedec drawing mo-229, for proper dimensions, tolerances, datums, etc. 2. the terminal #1 id is a laser-marked feature. 3. dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. if the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 8ma2, 8-pad, 2 x 3 x 0.6 mm body, thermally enhanced plastic ultra thin dual flat no lead package (udfn) package drawing contact: packagedrawings@atmel.com www.datasheet.net/ datasheet pdf - http://www..co.kr/
22 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 14.4 5ts1 ? 5-lead sot23 drawing no. rev. title gpc package drawing contact: packagedrawings@atmel.com 5ts1 d 5/31/12 5ts1, 5-lead 1.60mm body, plastic thin shrink small outline package (shrink sot) tsz common dimensions (unit of measure = mm) symbol min nom max note a - - 1.00 a1 0.00 - 0.10 a2 0.70 0.90 1.00 c 0.08 - 0.20 3 d 2.90 bsc 1,2 e 2.80 bsc 1,2 e1 1.60 bsc 1,2 l1 0.60 ref e 0.95 bsc e1 1.90 bsc b 0.30 - 0.50 3,4 1. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 mm per end. dimension e1 does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.15 mm per side. 2. the package top may be smaller than the package bottom. dimensions d and e1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. these dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 4. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. the dambar cannot be located on the lower radius of the foot. minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. this drawing is for general information only. refer to jedec drawing mo-193, variation ab for additional information. 5 4 2 l1 l c end view c a a2 a1 b e plane seating d side view e e1 e1 3 1 top view www.datasheet.net/ datasheet pdf - http://www..co.kr/
23 atmel AT24CS04/08 [preliminary datasheet] 8766a?seepr?6/12 15. revision history doc. rev. date comments 8766a 06/2012 initial document release. www.datasheet.net/ datasheet pdf - http://www..co.kr/
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